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  • Bipolar Transistor Arrays(65)
Результат:(65)

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    TPCP8901(TE85L,F,M

    TRANS NPN/PNP 50V 1A PS8

    Toshiba Semiconductor and Storage

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    TPCP8701(TE85L,F,M

    TRANS 2NPN 80V 3A PS8

    Toshiba Semiconductor and Storage

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    HN1A01F-Y(TE85L,F)

    TRANS 2PNP 50V 0.15A SM6

    Toshiba Semiconductor and Storage

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    HN1B04FU-Y(T5L,F,T

    TRANS NPN/PNP 50V 0.15A US6

    Toshiba Semiconductor and Storage

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    HN1B01FU-Y(L,F,T)

    TRANS NPN/PNP 50V 0.15A US6

    Toshiba Semiconductor and Storage

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    HN1B04F(TE85L,F)

    TRANS NPN/PNP 30V 0.5A SM6

    Toshiba Semiconductor and Storage

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    HN2A01FE-GR(TE85LF

    TRANS 2PNP 50V 0.15A ES6

    Toshiba Semiconductor and Storage

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    HN2C01FU-Y(TE85L,F

    TRANS 2NPN 50V 0.15A US6

    Toshiba Semiconductor and Storage

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    HN1C01FU-Y(T5L,F,T

    TRANS 2NPN 50V 0.15A US6

    Toshiba Semiconductor and Storage

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    HN2C01FE-GR(T5L,F)

    TRANS 2NPN 50V 0.15A ES6

    Toshiba Semiconductor and Storage

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    HN4B04J(TE85L,F)

    TRANS NPN/PNP 30V 0.5A SMV

    Toshiba Semiconductor and Storage

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    HN3C51F-GR(TE85L,F

    TRANS 2NPN 120V 0.1A SM6

    Toshiba Semiconductor and Storage

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    HN3C51F-BL(TE85L,F

    TRANS 2NPN 120V 0.1A SM6

    Toshiba Semiconductor and Storage

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    HN3A51F(TE85L,F)

    TRANS 2PNP 120V 0.1A SM6

    Toshiba Semiconductor and Storage

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    HN1C01F-GR(TE85L,F

    TRANS 2NPN 50V 0.15A SM6

    Toshiba Semiconductor and Storage

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    ULN2004AFWG,N,E

    IC PWR RELAY 7NPN 1:1 16SOL

    Toshiba Semiconductor and Storage

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    ULN2803AFWG,C,EL

    TRANS 8NPN DARL 50V 0.5A 18SOL

    Toshiba Semiconductor and Storage

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    TPC6901(TE85L,F,M)

    TRANS NPN/PNP 50V 6VS

    Toshiba Semiconductor and Storage

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    ULN2004APG,C,N

    IC PWR RELAY 7NPN 1:1 16DIP

    Toshiba Semiconductor and Storage

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    ULN2803APG,CN

    TRANS 8NPN DARL 50V 0.5A 18DIP

    Toshiba Semiconductor and Storage

  • Total 65
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    Bipolar transistor arrays incorporate two or more discrete transistors in a shared package, either as electrically separate entities or with interconnections of some form between them being made inside the device package. Arrays in which the devices contained have closely matched or complementary characteristics, the co-packaged character minimizes temperature differences between devices during operation.
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